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Inventor profile of:

Mark Solder

City:

Santa Barbara, California

Country:

United States

Published Applications:

1

Last publication date:

2024-09-12

Recent patent applications by Solder Mark

Mark Solder from Santa Barbara, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-09-12

US20240304508A1

MULTI-THICKNESS CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USING LATERAL DIELECTRIC MATERIAL

InventorID:

6777224 ⎘