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Inventor profile of:

Kandy Sun

City:

Shanghai

Country:

China

Published Applications:

1

Last publication date:

2024-09-12

Recent patent applications by Sun Kandy

Kandy Sun from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-09-12

US20240304515A1

HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE

InventorID:

6777225 ⎘