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Inventor profile of:

Chris LEE

City:

Taichung

Country:

Taiwan

Published Applications:

1

Last publication date:

2024-09-26

Recent patent applications by LEE Chris

Chris LEE from Taichung, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-09-26

US20240321793A1

CHIP PACKAGE ASSEMBLY WITH ENHANCED SOLDER PITCH

InventorID:

6791253 ⎘