Manish DUBEY

City:

Austin, Texas

Country:

United States

Published Applications:

Last publication date:

2026-05-14

Recent patent applications by DUBEY Manish

Manish DUBEY from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:

CHIP PACKAGE WITH METAL THERMAL INTERFACE MATERIAL RETAINER

CONNECTOR ASSEMBLY WITH MAGNETIC GUIDES

INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE

INTEGRATED CIRCUIT DIE STACK WITH A DUAL-SIDED BRIDGE DIE

INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE

CHIP PACKAGE WITH A THERMAL CARRIER

STIFFENER WITH INTEGRATED CONNECTORS

LID ASSEMBLY FOR A CHIP PACKAGE

InventorID:

6799882 ⎘