Eungmin LEE

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2024-10-17

Top Assignees for applications by Eungmin LEE

The entities that hold a legal rights for patent applications filed by inventor LEE Eungmin:

Eungmin LEE from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME

InventorID:

6809023 ⎘