Shunya OHBUCHI

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2024-10-24

Top Assignees for applications by Shunya OHBUCHI

The entities that hold a legal rights for patent applications filed by inventor OHBUCHI Shunya:

FURUKAWA ELECTRIC CO., LTD. 1 Tokyo, Japan

Recent patent applications by OHBUCHI Shunya

Shunya OHBUCHI from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-10-24

US20240352289A1

Chemistry; metallurgy

THERMALLY CONDUCTIVE FILM ADHESIVE COMPOSITION AND THERMALLY CONDUCTIVE FILM ADHESIVE, AND SEMICONDUCTOR PACKAGE USING THERMALLY CONDUCTIVE FILM ADHESIVE AND PRODUCING METHOD THEREOF

InventorID:

6817062 ⎘