Soo Won Lee

City:

JIANGSU

Country:

China

Published Applications:

Last publication date:

2024-12-05

Top Assignees for applications by Soo Won Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Soo Won:

Soo Won Lee from JIANGSU, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

PACKAGE STRUCTURE AND RELATED MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND PREPARATION METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND FORMING METHOD THEREOF

InventorID:

6826442 ⎘