Dahee PARK

City:

Suwon-si

Country:

South Korea

Published Applications:

Last publication date:

2026-01-01

Recent patent applications by PARK Dahee

Dahee PARK from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

SEMICONDUCTOR PACKAGE INCLUDING SOLDER STRUCTURE AND SEMICONDUCTOR MODULE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

InventorID:

6839738 ⎘