Pavan Kumar Varma Buddaraju

City:

Milpitas, California

Country:

United States

Published Applications:

Last publication date:

2024-11-28

Top Assignees for applications by Pavan Kumar Varma Buddaraju

The entities that hold a legal rights for patent applications filed by inventor Buddaraju Pavan Kumar Varma:

APPLE INC. 1 Cupertino, CA United States

Recent patent applications by Buddaraju Pavan Kumar Varma

Pavan Kumar Varma Buddaraju from Milpitas, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-11-28

US20240395660A1

Electricity

THERMAL MANAGEMENT MODULE OF AN INTEGRATED CIRCUIT ASSEMBLY

#2 | 2024-11-21

US20240389269A1

Electricity

THERMAL MODULE AND JOINING METHOD FOR HERMETICALLY SEALED ENCLOSURE OF A THERMAL MODULE USING A CAPILLARY JOINT

InventorID:

6847302 ⎘