Daisuke Watanabe

City:

Okazaki

Country:

Japan

Published Applications:

Last publication date:

2024-03-21

Top Assignees for applications by Daisuke Watanabe

The entities that hold a legal rights for patent applications filed by inventor Watanabe Daisuke:

TOYOTA BOSHOKU KABUSHIKI KAISHA 1 Aichi-ken, Japan
Takagi Chemicals, Inc. 1 Okazaki-Shi, Japan
TAKAGI CHEMICALS, INC. 1 Aichi-ken, Japan
TAKAGI CHEMICALS, INC. 1 Okazaki, Japan

Recent patent applications by Watanabe Daisuke

Daisuke Watanabe from Okazaki, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-03-21

US20240092981A1

Chemistry; metallurgy

Filler-loaded high thermal conductive dispersion liquid composition having excellent segregation stability, method for producing said dispersion liquid composition, filler-loaded high thermal conductive material using said dispersion liquid composition, method for producing said material, and molded article obtained using said material

#2 | 2022-12-01

US20220379569A1

Performing operations; transporting

Method for manufacturing fuel cell separator

InventorID:

6847633 ⎘