Daisuke KIMURA

City:

Settsu-shi, Osaka

Country:

Japan

Published Applications:

Last publication date:

2024-11-28

Recent patent applications by KIMURA Daisuke

Daisuke KIMURA from Settsu-shi, Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-11-28

US20240392465A1

Chemistry; metallurgy

METHOD OF MANUFACTURING CONICAL HOLLOW NEEDLE

InventorID:

6850864 ⎘