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Inventor profile of:

Daniel I. Disch

City:

Brookfield, Wisconsin

Country:

United States

Published Applications:

1

Last publication date:

2024-11-28

Recent patent applications by Disch Daniel I.

Daniel I. Disch from Brookfield, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-11-28

US20240392916A1

Mechanical engineering

MOUNTING BRACKET FOR THERMOSTAT

InventorID:

6851293 ⎘