Kohei ABE

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-09-25

Recent patent applications by ABE Kohei

Kohei ABE from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-09-25

US20250297129A1

Chemistry; metallurgy

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

#2 | 2024-11-28

US20240393686A1

Physics

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTILAYERED PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING MULTILAYERED PRINTED WIRING BOARD

InventorID:

6851978 ⎘