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Inventor profile of:

Tomohiro AYUGASE

City:

Tokyo

Country:

Japan

Published Applications:

4

Last publication date:

2025-10-02

Recent patent applications by AYUGASE Tomohiro

Tomohiro AYUGASE from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-10-02

US20250306465A1

PHOTOSENSITIVE MULTILAYER RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

#2 | 2025-07-10

US20250227853A1

PHOTOSENSITIVE MULTILAYER RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

#3 | 2025-07-10

US20250226236A1

PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

#4 | 2024-11-28

US20240393686A1

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTILAYERED PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING MULTILAYERED PRINTED WIRING BOARD

InventorID:

6851981 ⎘