Sing-Da JIANG

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2025-11-20

Top Assignees for applications by Sing-Da JIANG

The entities that hold a legal rights for patent applications filed by inventor JIANG Sing-Da:

Sing-Da JIANG from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor Device Package with Thermal Module

METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL HOT SPOT REGION OF AN IC STRUCTURE

INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS

METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL HOT SPOT REGION OF AN IC STRUCTURE

Semiconductor Device Package with Thermal Module

InventorID:

6853464 ⎘