Keisuke Oguma

City:

Shiga

Country:

Japan

Published Applications:

Last publication date:

2024-12-05

Top Assignees for applications by Keisuke Oguma

The entities that hold a legal rights for patent applications filed by inventor Oguma Keisuke:

Keisuke Oguma from Shiga, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

POLYAMIDE ACID, POLYIMIDE, NON-THERMOPLASTIC POLYIMIDE FILM, MULTI-LAYERED POLYIMIDE FILM, AND METAL-CLAD LAMINATE

InventorID:

6856589 ⎘