Chicago, Illinois
United States
18
2024-01-04
The entities that hold a legal rights for patent applications filed by inventor Chen Mai:
Mai Chen from Chicago, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Article
#2 | 2024-01-04Article
#3 | 2022-11-17Retort adhesive composition
#4 | 2021-09-16Two-component solventless adhesive compositions and methods of making same
#5 | 2021-08-12Processes for making coated films and solventless polyurethane precursors that may be used to make coated films
#6 | 2021-08-12COATED FILMS
#7 | 2020-05-21TWO-COMPONENT SOLVENTLESS ADHESIVE COMPOSITIONS
#8 | 2020-05-07Two-component solventless adhesive compositions
#9 | 2020-04-23Water borne dry lamination bonding agent with heat resistance improvement
#10 | 2017-09-21A MULTILAYER STRUCTURE AND A PACKAGING COMPRISING THE SAME
#11 | 2016-09-08Method of bonding to foil
#12 | 2016-09-08Method of bonding to foil
#13 | 2016-08-11Method of making laminates having reduced oxygen permeability
#14 | 2015-12-17Waterborne adhesives
#15 | 2015-12-10Aqueous dispersion of fatty amide
#16 | 2015-09-24MIXTURE OF ISOCYANATE COMPOUNDS AND ITS USE AS EMULSIFIER
#17 | 2014-04-03Water-borne adhesives
#18 | 2014-03-13WATER-BORNE ADHESIVES
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