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Inventor profile of:

Ashish Kumar Sahoo

City:

Hsinchu

Country:

Taiwan

Published Applications:

1

Last publication date:

2024-12-05

Recent patent applications by Sahoo Ashish Kumar

Ashish Kumar Sahoo from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-12-05

US20240404991A1

METHOD AND STRUCTURE FOR A THREE-DIMENSIONAL PACKAGE

InventorID:

6861325 ⎘