Daisuke Nakajima

City:

Ageo

Country:

Japan

Published Applications:

Last publication date:

2023-08-31

Top Assignees for applications by Daisuke Nakajima

The entities that hold a legal rights for patent applications filed by inventor Nakajima Daisuke:

Daisuke Nakajima from Ageo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

MANUFACTURING METHODS FOR COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD

Copper-clad laminate plate and printed wiring board

ELECTROLYTIC COPPER FOIL

Electrolytic copper foil

InventorID:

6869409 ⎘