Ryan LEWIS

City:

Niles, Ohio

Country:

United States

Published Applications:

Last publication date:

2026-05-07

Top Assignees for applications by Ryan LEWIS

The entities that hold a legal rights for patent applications filed by inventor LEWIS Ryan:

Ryan LEWIS from Niles, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Substrate Coupling System and Method

Sleeve Assembly for Wiring Harness Installation

Substrate Manipulation System and Method

Seal Assembly

DEVICE FOR WINDING AND RETAINING ELONGATED CONDUCTORS WITH ROBOTIC MANIPULATION CAPABILITY

Connector Staging System and Method

Connector Assembly System and Related Methods

TERMINAL ASSEMBLY WITH TERMINAL INSPECTION PORT AND METHODS OF ASSEMBLING SAME

InventorID:

6903899 ⎘