Tokyo
Japan
6
2026-03-19
The entities that hold a legal rights for patent applications filed by inventor Morimura Miki:
Miki Morimura from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
HOLLOW PARTICLES, RESIN COMPOSITION AND MOLDED BODY
#2 | 2025-09-25HOLLOW PARTICLES, RESIN COMPOSITION, RESIN MOLDED BODY, ENCAPSULATING RESIN COMPOSITION, CURED PRODUCT AND SEMICONDUCTOR DEVICE
#3 | 2025-05-01HOLLOW PARTICLES, RESIN COMPOSITION, AND RESIN MOLDED BODY
#4 | 2025-02-06HOLLOW PARTICLES, METHOD FOR PRODUCING HOLLOW PARTICLES, AND RESIN COMPOSITION
#5 | 2025-01-30HOLLOW PARTICLES, METHOD FOR PRODUCING HOLLOW PARTICLES, AND RESIN COMPOSITION
#6 | 2025-01-23HOLLOW PARTICLES, RESIN COMPOSITION, AND RESIN MOLDED BODY
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