Inventor profile of:

Heiko Brunner

City:

Berlin

Country:

Germany

Published Applications:

31

Last publication date:

2025-09-25

Top Assignees for applications by Heiko Brunner

The entities that hold a legal rights for patent applications filed by inventor Brunner Heiko:

Recent patent applications by Brunner Heiko

Heiko Brunner from Berlin, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-09-25
US20250297398A1
Chemistry; metallurgy

METHOD FOR DEPOSITING A ZINC-NICKEL ALLOY ON A SUBSTRATE, AN AQUEOUS ZINC-NICKEL DEPOSITION BATH, A BRIGHTENING AGENT AND USE THEREOF

#2 | 2025-01-30
US20250034718A1
Chemistry; metallurgy

USE OF AN AQUEOUS ALKALINE COMPOSITION FOR THE ELECTROLESS DEPOSITION OF A METAL OR METAL ALLOY ON A METAL SURFACE OF A SUBSTRATE

#3 | 2023-10-05
US20230313401A1
Chemistry; metallurgy

COPPER ELECTROPLATING BATH

#4 | 2023-07-13
US20230220558A1
Chemistry; metallurgy

AN AQUEOUS BASIC ETCHING COMPOSITION FOR THE TREATMENT OF SURFACES OF METAL SUBSTRATES

#5 | 2020-10-29
US20200340132A1
Chemistry; metallurgy

Metal or metal alloy deposition composition and plating compound

#6 | 2020-07-23
US20200231565A1
Chemistry; metallurgy

Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths

#7 | 2020-06-25
US20200199766A1
Chemistry; metallurgy

Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy

#8 | 2019-08-29
US20190264328A1
Chemistry; metallurgy

METHOD FOR PROVIDING A MULTILAYER COATING ON A SURFACE OF A SUBSTRATE

#9 | 2019-05-16
US20190144667A1
Chemistry; metallurgy

Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions

#10 | 2018-11-29
US20180340261A1
Chemistry; metallurgy

PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM

#11 | 2018-11-29
US20180340260A1
Chemistry; metallurgy

Plating bath composition and method for electroless plating of palladium

#12 | 2018-08-09
US20180223442A1
Chemistry; metallurgy

Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate

#13 | 2018-04-26
US20180112320A1
Chemistry; metallurgy

Electrolytic copper plating bath compositions and a method for their use

#14 | 2017-11-16
US20170327954A1
Chemistry; metallurgy

Plating bath compositions for electroless plating of metals and metal alloys

#15 | 2017-10-17
US15666649
Chemistry; metallurgy

3-(carbamoyl) pyridinium-1-YL-propane-1-sulfonates useful in electroplating baths

#16 | 2017-03-23
US20170086305A1
Electricity

Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound

#17 | 2016-02-25
US20160053395A1
Chemistry; metallurgy

Galvanic nickel electroplating bath for depositing a semi-bright nickel

#18 | 2015-10-22
US20150299883A1
Chemistry; metallurgy

Copper plating bath composition

#19 | 2015-04-23
US20150110965A1
Chemistry; metallurgy

Plating bath for electroless deposition of nickel layers

#20 | 2014-12-25
US20140377471A1
Chemistry; metallurgy

Alkaline plating bath for electroless deposition of cobalt alloys

#21 | 2014-05-08
US20140124376A1
Chemistry; metallurgy

Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys

#22 | 2014-03-20
US20140076461A1
Electricity

Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound

#23 | 2012-06-28
US20120160698A1
Chemistry; metallurgy

Polymers having terminal amino groups and use thereof as additives for zinc and zinc alloy electrodeposition baths

#24 | 2011-04-28
US20110094583A1
Electricity

Electroplating additive for the deposition of metal, a binary, ternary, quaternary or pentanary alloy of elements of group 11 (IB)—group 13 (IIIA)—Group 16 (VIA)

#25 | 2011-01-20
US20110011746A1
Chemistry; metallurgy

Aqueous, acid bath and method for the electrolytic deposition of copper

#26 | 2010-12-30
US20100326838A1
Chemistry; metallurgy

PYROPHOSPHATE-CONTAINING BATH FOR CYANIDE-FREE DEPOSITION OF COPPER-TIN ALLOYS

#27 | 2010-12-02
US20100300890A1
Chemistry; metallurgy

Pyrophosphate-based bath for plating of tin alloy layers

#28 | 2010-09-23
US20100236936A1
Chemistry; metallurgy

Aqueous,alkaline,cyanide-free bath for the galvanic deposition of zinc and zinc alloy coatings

#29 | 2010-06-24
US20100155257A1
Chemistry; metallurgy

Aqueous, alkaline, cyanide-free bath for the galvanic deposition of zinc alloy coatings

#30 | 2008-11-20
US20080282485A1
Chemistry; metallurgy

Navy Blue and Black Mixtures, Method for the Production Thereof, and Their Use for Dying Material Containing Hydroxy Groups

#31 | 2006-12-28
US20060288500A1
Chemistry; metallurgy

Novel quinoneimine sulfur dye compositions, production thereof and use for dyeing cellulosic material

InventorID:

690684 ⎘