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Inventor profile of:

Michael Murphy

City:

Niskayuna, New York

Country:

United States

Published Applications:

5

Last publication date:

2026-05-07

Recent patent applications by Murphy Michael

Michael Murphy from Niskayuna, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-05-07
US20260130298A1
Electricity

SUBSTRATE BONDING WITH LOCAL BONDING REGION SHAPE CONTROL

#2 | 2026-03-05
US20260063989A1
Physics

MONOMER AND POLYMER COMPOSITIONS FOR REVERSIBLE OVERCOAT WAFER PATTERNING

#3 | 2025-10-02
US20250306468A1
Physics

MULTIPATTERNING WITH CROSSLINKABLE OVERCOAT

#4 | 2025-10-02
US20250306463A1
Physics

PATTERNING A SUBSTRATE USING A MULTI-PATTERNING TECHNIQUE

#5 | 2025-01-23
US20250029837A1
Electricity

METHODS AND COMPOSITIONS FOR TRENCH FORMATION USING ADVANCED TRACK-BASED PATTERNING PROCESSES

InventorID:

6909611 ⎘

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