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Inventor profile of:

YANBIN PENG

City:

Shanghai

Country:

China

Published Applications:

1

Last publication date:

2025-01-23

Recent patent applications by PENG YANBIN

YANBIN PENG from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-01-23

US20250029905A1

STRUCTURE OF CHIP PACKAGE INTEGRATED ANTENNA AND MANUFACTURING METHOD THEREOF

InventorID:

6909657 ⎘