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Inventor profile of:

Ben Hall

City:

Boulder, Colorado

Country:

United States

Published Applications:

1

Last publication date:

2025-01-23

Recent patent applications by Hall Ben

Ben Hall from Boulder, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-01-23

US20250031347A1

Three-Dimensional Meshes and Casings for Thermal Ground Planes

InventorID:

6910449 ⎘