Tomoki KITAGAWA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-01-30

Top Assignees for applications by Tomoki KITAGAWA

The entities that hold a legal rights for patent applications filed by inventor KITAGAWA Tomoki:

Tomoki KITAGAWA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

THERMOSETTING RESIN COMPOSITION, RESIN COMPOSITION FOR PRINTED WIRING BOARD, AND RESIN COMPOSITION FOR PRINTED WIRING BOARD SUBSTRATE

InventorID:

6913461 ⎘