Austin, Texas
United States
16
2016-04-28
The entities that hold a legal rights for patent applications filed by inventor Pham Tim V.:
Tim V. Pham from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Die stack address bus having a programmable width
#2 | 2016-01-07Matrix lid heatspreader for flip chip package
#3 | 2015-10-08Defective die replacement in a die stack
#4 | 2015-07-23Thin low profile strip dual in-line memory module
#5 | 2015-04-30Wirebond recess for stacked die
#6 | 2015-04-09Heat conductive substrate for integrated circuit package
#7 | 2015-03-26Package encapsulant relief feature
#8 | 2015-03-12RECESSED SEMICONDUCTOR DIE STACK
#9 | 2015-03-05Edge coupling of semiconductor dies
#10 | 2015-01-08Using an integrated circuit die configuration for package height reduction
#11 | 2014-10-16Fluid cooled semiconductor die package
#12 | 2014-08-14Methods and structures for reducing stress on die assembly
#13 | 2014-03-20Matrix lid heatspreader for flip chip package
#14 | 2010-10-21Dynamic pad size to reduce solder fatigue
#15 | 2008-08-07Dynamic pad size to reduce solder fatigue
#16 | 2005-06-14Method for processing multiple semiconductor devices for test
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