Dadi SETIADI

City:

Shanghai

Country:

China

Published Applications:

Last publication date:

2025-06-05

Top Assignees for applications by Dadi SETIADI

The entities that hold a legal rights for patent applications filed by inventor SETIADI Dadi:

Dadi SETIADI from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF, AND PHOTONIC INTEGRATED CIRCUIT CHIP

WAVEGUIDE STRUCTURE AND MANUFACTURING METHOD THEREOF, AND PHOTONIC INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

InventorID:

6922018 ⎘