Wei Chen

City:

Saga

Country:

Japan

Published Applications:

Last publication date:

2022-01-06

Top Assignees for applications by Wei Chen

The entities that hold a legal rights for patent applications filed by inventor Chen Wei:

TANAKA DENSHI KOGYO K. K. 1 Kanzaki-gun, Japan

Recent patent applications by Chen Wei

Wei Chen from Saga, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-01-06

US20220005781A1

Electricity

Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereof

InventorID:

6938261 ⎘