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Inventor profile of:

Hang Yan

City:

Chengdu

Country:

China

Published Applications:

2

Last publication date:

2025-04-03

Recent patent applications by Yan Hang

Hang Yan from Chengdu, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-04-03

US20250112133A1

PACKAGES WITH STEPPED CONDUCTIVE TERMINALS

#2 | 2025-02-27

US20250069999A1

DYNAMIC PLATED METAL THICKNESS FOR SEMICONDUCTOR PACKAGE

InventorID:

6943366 ⎘