Yingjun Wu

City:

Hubei

Country:

China

Published Applications:

Last publication date:

2024-06-13

Top Assignees for applications by Yingjun Wu

The entities that hold a legal rights for patent applications filed by inventor Wu Yingjun:

Yingjun Wu from Hubei, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Dies, semiconductor package structures, enable pin configuration methods and memories

InventorID:

6960004 ⎘