Mark Lefebvre

City:

Hudson, New Hampshire

Country:

United States

Published Applications:

Last publication date:

2018-01-18

Top Assignees for applications by Mark Lefebvre

The entities that hold a legal rights for patent applications filed by inventor Lefebvre Mark:

Rohm and Haas Electronic Materials LLC 16 Marlborough, MA United States
DOW GLOBAL TECHNOLOGIES LLC 4 Midland, MI United States

Recent patent applications by Lefebvre Mark

Mark Lefebvre from Hudson, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-01-18

US20180016691A1

Chemistry; metallurgy

Indium electroplating compositions containing amine compounds and methods of electroplating indium

#2 | 2018-01-18

US20180016690A1

Chemistry; metallurgy

INDIUM ELECTROPLATING COMPOSITIONS CONTAINING 2-IMIDAZOLIDINETHIONE COMPOUNDS AND METHODS FOR ELECTROPLATING INDIUM

#3 | 2018-01-18

US20180016689A1

Chemistry; metallurgy

INDIUM ELECTROPLATING COMPOSITIONS AND METHODS FOR ELECTROPLATING INDIUM

#4 | 2017-11-07

US15212737

Chemistry; metallurgy

Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium

#5 | 2017-05-25

US20170145577A1

Chemistry; metallurgy

METHOD OF ELECTROPLATING LOW INTERNAL STRESS COPPER DEPOSITS ON THIN FILM SUBSTRATES TO INHIBIT WARPING

#6 | 2017-03-09

US20170067173A1

Chemistry; metallurgy

ACID COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROPLATING LOW INTERNAL STRESS AND GOOD DUCTILITY COPPER DEPOSITS

#7 | 2017-02-09

US20170042037A1

Electricity

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides

#8 | 2017-02-09

US20170037528A1

Chemistry; metallurgy

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds

#9 | 2017-02-09

US20170037527A1

Chemistry; metallurgy

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides

#10 | 2017-02-09

US20170037526A1

Chemistry; metallurgy

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds

#11 | 2016-10-27