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Inventor profile of:

Chung-Hsier YANG

City:

Jiangsu

Country:

China

Published Applications:

1

Last publication date:

2025-03-20

Recent patent applications by YANG Chung-Hsier

Chung-Hsier YANG from Jiangsu, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-03-20

US20250096105A1

PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF

InventorID:

6965446 ⎘