Philipp Seng

City:

München

Country:

Germany

Published Applications:

Last publication date:

2025-04-17

Recent patent applications by Seng Philipp

Philipp Seng from München, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE

Power Semiconductor Device and Method of Producing a Power Semiconductor Device

InventorID:

6974279 ⎘