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Inventor profile of:

Bin Zeng

City:

Shenzhen

Country:

China

Published Applications:

4

Last publication date:

2025-07-17

Top Assignees for applications by Bin Zeng

The entities that hold a legal rights for patent applications filed by inventor Zeng Bin:

Huawei Device Co., Ltd. 1 Shenzhen, China
HON HAI PRECISION INDUSTRY CO., LTD. 1 Tu-Cheng, Taiwan
FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD. 1 ShenZhen City, China
HON HAI PRECISION INDUSTRY CO., LTD. 1 New Taipei, Taiwan
Shenzhen SETOO Technology Co., Ltd. 1 Shenzhen, China
Shenzhen Second People's Hospital (Shenzhen Institute of Translational Medicine) 1 Shenzhen, China
FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD. 1 Shenzhen, China
Shenzhen Joy Innovation Technology Co., Ltd. 1 Shenzhen, China
Huawei Device Co., Ltd. 1 Shenzhen, Guangdong, -
SHENZHEN INSTITUTE OF ADVANCED TECHNOLOGY CHINESE ACADEMY OF SCIENCES 1 Shenzhen, China

Recent patent applications by Zeng Bin

Bin Zeng from Shenzhen, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-07-17

US20250229970A1

Performing operations; transporting

MASON JAR SEALING STRUCTURE

#2 | 2025-01-23

US20250027948A1

EXTRACTION METHOD AND USE OF CUCUMBER RIBOSOME

#3 | 2014-03-20

US20140082246A1

Data terminal with a connection structure of USB interface

#4 | 2013-07-11

US20130175359A1

Performing operations; transporting

Nozzle assembly

InventorID:

697705 ⎘