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Inventor profile of:

Sing-Da Jiang

City:

Taichung

Country:

Taiwan

Published Applications:

1

Last publication date:

2025-04-03

Recent patent applications by Jiang Sing-Da

Sing-Da Jiang from Taichung, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-04-03

US20250112137A1

INTEGRATED CIRCUIT PACKAGE AND METHOD

InventorID:

6979517 ⎘