Daniel MIRANDA

City:

Seattle, Washington

Country:

United States

Published Applications:

Last publication date:

2025-04-10

Top Assignees for applications by Daniel MIRANDA

The entities that hold a legal rights for patent applications filed by inventor MIRANDA Daniel:

Daniel MIRANDA from Seattle, US has applied for patents for these inventions. The list has both pending applications and granted patents:

BATTERY ENCLOSURE INCLUDING MULTI-FUNCTIONAL, MULTI-LAYERED THERMOPLASTIC COMPOSITE LAMINATED STRUCTURE

MULTI-FUNCTIONAL, MULTI-LAYERED HYBRID COMPOSITE STRUCTURE

METHODS FOR COMPRESSION MOLDING MULTI-LAYERED AND MULTI-FUNCTIONAL THERMOPLASTIC COMPOSITE STRUCTURES

InventorID:

6982101 ⎘