Jun Okada

City:

Kobe City

Country:

Japan

Published Applications:

Last publication date:

2016-04-07

Top Assignees for applications by Jun Okada

The entities that hold a legal rights for patent applications filed by inventor Okada Jun:

Jun Okada from Kobe City, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

COVER MEMBER AND ELECTRONIC DEVICE

RESIN COMPOSITION, SUBSTRATE, METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICES

RESIN COMPOSITION, METHOD OF MANUFACTURING RESIN COMPOSITION, SUBSTRATE, METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

RESIN COMPOSITION, SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

RESIN COMPOSITION, SUBSTRATE, METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

SOLUTION OF AROMATIC POLYAMIDE FOR PRODUCING DISPLAY ELEMENT, OPTICAL ELEMENT, OR ILLUMINATION ELEMENT

SOLUTION OF AROMATIC POLYAMIDE FOR PRODUCING DISPLAY ELEMENT, OPTICAL ELEMENT, OR ILLUMINATION ELEMENT

InventorID:

699356 ⎘