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Inventor profile of:

Farzin NAJAFI

City:

Ottawa

Country:

Canada

Published Applications:

2

Last publication date:

2025-05-01

Recent patent applications by NAJAFI Farzin

Farzin NAJAFI from Ottawa, CA has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-05-01

US20250140674A1

MULTI-DIE PACKAGE

#2 | 2025-05-01

US20250140665A1

LEADED PACKAGE USING ROUTING LAYER FOR INTEGRATED CIRCUIT DIE

InventorID:

7004924 ⎘