San Lee

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2026-01-15

Recent patent applications by Lee San

San Lee from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

HEAT DISSIPATION SHEET, CIRCUIT BOARD, AND ELECTRONIC DEVICE

FLEXIBLE CIRCUIT BOARD FOR CHIP INTEGRATION AND ELECTRONIC DEVICE HAVING THE SAME

InventorID:

7006044 ⎘