Si CHEN

City:

Ann Arbor, Michigan

Country:

United States

Published Applications:

Last publication date:

2025-05-15

Recent patent applications by CHEN Si

Si CHEN from Ann Arbor, US has applied for patents for these inventions. The list has both pending applications and granted patents:

MULTI-ADDITIVE SYSTEM FOR HIGH DIELECTRIC STRENGTH, HIGH THERMAL CONDUCTIVITY, HIGH TEMPERATURE POLYMER INSULATION FOR ADVANCED WIRING APPLICATION

InventorID:

7016177 ⎘