Jun Ikeda

City:

Ibaraki

Country:

Japan

Published Applications:

Last publication date:

2024-06-27

Top Assignees for applications by Jun Ikeda

The entities that hold a legal rights for patent applications filed by inventor Ikeda Jun:

HITACHI CONSTRUCTION MACHINERY CO., LTD. 1 Tokyo, Japan
NITTO DENKO CORPORATION 1 Osaka, Japan

Recent patent applications by Ikeda Jun

Jun Ikeda from Ibaraki, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-06-27

US20240208389A1

Performing operations; transporting

Dump truck

#2 | 2023-03-09

US20230071071A1

Chemistry; metallurgy

RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR, RESIN MOLDED PRODUCT FOR SEALING OPTICAL SEMICONDUCTOR, OPTICAL SEMICONDUCTOR SEALING MATERIAL, AND OPTICAL SEMICONDUCTOR DEVICE

InventorID:

7034598 ⎘