Dandan Lyu

City:

Dublin, California

Country:

United States

Published Applications:

Last publication date:

2024-11-19

Top Assignees for applications by Dandan Lyu

The entities that hold a legal rights for patent applications filed by inventor Lyu Dandan:

Dandan Lyu from Dublin, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Systems and methods of simulating drop shock reliability of solder joints with a multi-scale model

Systems and methods of simulating drop shock reliability of solder joints with a multi-scale model

InventorID:

7055123 ⎘