Yingming Wu

City:

Beijing

Country:

China

Published Applications:

Last publication date:

2024-10-08

Top Assignees for applications by Yingming Wu

The entities that hold a legal rights for patent applications filed by inventor Wu Yingming:

Yingming Wu from Beijing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Method for determining thickness of metal film of wafer, polishing device, and medium

InventorID:

7057075 ⎘