Ryuji UEDA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-02-20

Top Assignees for applications by Ryuji UEDA

The entities that hold a legal rights for patent applications filed by inventor UEDA Ryuji:

Toppan Printing Co., Ltd. 2 Tokyo, Japan
DSM IP ASSETS B.V. 2 Heerlen, Netherlands
TOPPAN Holdings Inc. 1 Tokyo, Japan

Recent patent applications by UEDA Ryuji

Ryuji UEDA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-02-20

US20250057457A1

Human necessities

ELECTRODE DEVICE FOR LIVING BODY

#2 | 2017-12-14

US20170358700A1

Electricity

Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body

#3 | 2014-04-03

US20140090698A1

Electricity

Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body

#4 | 2006-06-15

US20060127690A1

Chemistry; metallurgy

Metal photoetching product and production method thereof

InventorID:

708375 ⎘