South Windsor, Connecticut
United States
9
2014-10-30
The entities that hold a legal rights for patent applications filed by inventor Baars Dirk M.:
Dirk M. Baars from South Windsor, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof
#2 | 2014-04-03Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith
#3 | 2011-09-08Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof
#4 | 2011-02-10Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
#5 | 2010-12-09Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith
#6 | 2010-01-21Circuit materials, circuits laminates, and method of manufacture thereof
#7 | 2009-07-30Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
#8 | 2007-04-26Circuit board materials with improved bond to conductive metals and methods of the manufacture thereof
#9 | 2006-11-21Apparatus and method of manufacture of electrochemical cell components
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