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Inventor profile of:

Seung Eun Lee

City:

Sungnam

Country:

South Korea

Published Applications:

Last publication date:

2015-07-09

Top Assignees for applications by Seung Eun Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Seung Eun:

SAMSUNG ELECTRO-MECHANICS CO., LTD. 13 Suwon, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 9 Suwon-si, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 1 Gyunggi-do, South Korea
SAMSUNG ELECTRONICS CO., LTD. 1 Suwon, South Korea
SAMSUNG ELECTRO-MECHANCIS CO., LTD. 1 Suwon, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 1 Kyungki-do, South Korea

Recent patent applications by Lee Seung Eun

Seung Eun Lee from Sungnam, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-07-09

US20150195907A1

Electricity

MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

#2 | 2015-01-29

US20150027757A1

Electricity

PCB HAVING GLASS CORE

#3 | 2014-10-30

US20140321084A1

Electricity

Printed circuit board including electronic component embedded therein and method for manufacturing the same

#4 | 2014-07-03

US20140185258A1

Electricity

Substrate embedding passive element

#5 | 2014-07-03

US20140182916A1

Electricity

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

#6 | 2014-07-03

US20140182911A1

Electricity

Printed circuit board including embedded electronic component and method for manufacturing the same

#7 | 2014-07-03

US20140182897A1

Electricity

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

#8 | 2014-07-03

US20140182896A1

Electricity

Substrate having electronic component embedded therein and method of manufacturing the same

#9 | 2014-07-03

US20140182895A1

Electricity

Multilayered substrate and method of manufacturing the same

#10 | 2014-07-03

US20140182889A1

Electricity

Multilayered substrate

#11 | 2014-06-26

US20140177192A1

Electricity

CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING THE SAME

#12 | 2014-06-05

US20140151104A1

Electricity

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF

#13 | 2014-05-29

US20140144676A1

Electricity

Electronic component embedded substrate and manufacturing method thereof

#14 | 2014-05-01

US20140116761A1

Electricity

Multilayer ceramic capacitor and printed circuit board including the same

#15 | 2014-04-03

US20140090881A1

Electricity

Passive device embedded in substrate and substrate with passive device embedded therein

#16 | 2008-10-02

US20080236878A1

Electricity

Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor

#17 | 2008-07-03

US20080158777A1

Electricity

Capacitor and multi-layer board embedding the capacitor

#18 | 2007-04-19

US20070085166A1

Electricity

Printed circuit board with film capacitor embedded therein and method for manufacturing the same

#19 | 2006-11-30

US20060271610A1

Physics

Digital signal processor having reconfigurable data paths

#20 | 2006-08-17

US20060183872A1

Chemistry; metallurgy

Resin composition for embedded capacitors having excellent adhesive strength, heat resistance and flame retardancy

#21 | 2006-08-17

US20060182973A1

Electricity

Resin composition and ceramic/polymer composite for embedded capacitors having excellent TCC property

InventorID:

708620 ⎘