Jun Lei

City:

Qingdao

Country:

China

Published Applications:

Last publication date:

2023-01-17

Top Assignees for applications by Jun Lei

The entities that hold a legal rights for patent applications filed by inventor Lei Jun:

Jun Lei from Qingdao, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Test method based on test system for five-dimensional space effects of ground surface settlement caused by dual-mode shield construction

InventorID:

7088593 ⎘