Inventor profile of:

Hongjun BAI

City:

Silver Spring, Maryland

Country:

United States

Published Applications:

1

Last publication date:

2025-07-03

Recent patent applications by BAI Hongjun

Hongjun BAI from Silver Spring, US has applied for patents for these inventions. The list has both pending applications and granted patents:

InventorID:

7120844 ⎘