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Inventor profile of:

Nu DAI

City:

Beijing

Country:

China

Published Applications:

1

Last publication date:

2025-07-03

Recent patent applications by DAI Nu

Nu DAI from Beijing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-07-03

US20250220563A1

NETWORK SLICING HIGH AVAILABILITY METHOD, APPARATUS, DEVICE, AND STORAGE MEDIUM

InventorID:

7126385 ⎘